| 摘要 |
A method and apparatus for soldering terminals to printed circuit boards, and particularly for soldering terminals simultaneously to both sides of a printed circuit board. The apparatus consists of a connected series of preformed cones of solder which are positioned above holes in the circuit board, and through which terminals to be heated are inserted. The solder flows through the hole by capillary action, and provides electrical connection between the terminal and conduction paths on both sides of the circuit board.
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