| 发明名称 |
ELECTRONIC CIRCUIT DEVICE |
| 摘要 |
<p>PURPOSE:To lower thermal resistance by pintching and securing chips with a first radiating substrate fo good thermal conductivity mounted with semiconductor chips and a second substrate having wiring patterns and connected to the chips.</p> |
| 申请公布号 |
JPS52114272(A) |
申请公布日期 |
1977.09.24 |
| 申请号 |
JP19760029947 |
申请日期 |
1976.03.22 |
| 申请人 |
HITACHI LTD |
发明人 |
NAKAGAWA MANABU;CHIBA TSUNEYA |
| 分类号 |
H01L23/34;H01L21/52;H01L23/36;H05K1/18 |
主分类号 |
H01L23/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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