发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:Wire-to-wire contact is prevented by using wires balled at both ends and performing-bonding at the ball parts so that a difference in height is produced between the loop of the emitter side lead-out wire of an element and the loop of its base side lead-out wire.
申请公布号 JPS5290267(A) 申请公布日期 1977.07.29
申请号 JP19760006764 申请日期 1976.01.23
申请人 TOKYO SHIBAURA ELECTRIC CO 发明人 HIRASE KIYOTO;KONNO HIDEO;SHIMIZU HIROAKI;NISHIKAWA TAKATOSHI
分类号 H01L21/60;H01L23/48 主分类号 H01L21/60
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