| 摘要 |
<p>1493322 Capacitors; semiconductor devices P R MALLORY & CO Inc 9 Jan 1975 [10 Jan 1974] 951/75 Headings H1M and H1K To cushion electrical component body 11, e.g. a solid tantalum electrolytic capacitor or a transistor, against stresses due to shrinkage of encapsulation 14 during its application, or thermal expansion effects during use, there is provided an intermediate layer 13 of compressible material comprising filler particles in a synthetic resin binder, such that cushioning layer 13 includes voids. The filler may be asbestos, mica, talc, kaolin, polyacrylonitrile fibres, silica, glass powder or fibres. The binder may be epoxy, vinyl, phenoxy, silicone, polyester, phenolic, alkyd a fluorocarbon resin. A composition for applying to the component may comprise 2 to 10% binder, 30 to 70% filler and the balance solvent which is removed on heating, i.e. the binder is a minor constituent of the cushioning layer, only sufficient being required to hold the filler particles together.</p> |
