| 摘要 |
<p>An electrically resistive coating composition exhibiting low resistivity when applied to a dielectric substrate employing inexpensive materials and without utilizing a solvent during application to the substrate. The conductive particles are carbon and are intermixed in a heat curable thermosetting acrylic resin which is a reaction product of acrylic or methacrylic acid and a polyepoxide of a phenol formaldehyde resin. The composition can be further polymerized with itself or with copolymerizable monomers such as styrene, vinyl toluene, methyl-methacrylate and ethylene glycol dimethacrylate. This thermosetting acrylic polymerization product is combined with an ethylene glycol dimethacrylate monomer into which are admixed conductive carbon particles and a filler material. The resulting product is cured with an organic curing agent and the resulting product fired onto a substrate at a temperature of at least 700 DEG F.</p> |
