| 摘要 |
A thermosetting resin composition consisting essentially of a solid epoxy resin having a molecular weight in the range 1,000-4,000, 1-15% by weight of the epoxy resin of a curing agent therefor and 0.5 to 3.0% by weight of the composition of a flow control agent consisting essentially of liquid poly(ethyl acrylate) having a number average molecular weight in the range 5,000 to 15,000. The composition when melt compounded and milled to an average particle size diameter of 2-20 microns can be electrostatically deposited onto metallic surfaces such as can interiors to produce an ultra thin (0.3-1.0 mil thick) protective coating on curing.
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