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发明名称
SHAPING OF LEADS SEALED IN LSI CHIP ETC*
摘要
申请公布号
JPS5219971(A)
申请公布日期
1977.02.15
申请号
JP19750096884
申请日期
1975.08.08
申请人
HIROHATA KOUSEI
发明人
HIROHATA KOUSEI
分类号
H01L23/50;H01L23/28;H01L23/48
主分类号
H01L23/50
代理机构
代理人
主权项
地址
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