| 摘要 |
A method for making electrical circuits on a non-conductive plate is disclosed. The invention provides for duplication of a circuit pattern on an insulating plate having a continuous deposit of electrically conductive material thereon by a mechanical linkage between a milling device, which removes the conductive deposit, and a scanning device, which is moved in accordance with a master pattern. In preferred embodiment the movement of both devices is confined to one of two or sometimes three co-ordinates for a particular portion of the pattern. The method is swift and efficient, and the invention is equally applicable to small or large-scale manufacture, although it is of especial value where small numbers of circuit boards are to be produced. |
