A TAILORED BARRIER LAYER WHICH PROVIDES IMPROVED COPPER INTERCONNECT ELECTROMIGRATION RESISTANCE,申请号KR1020007006556-传众专利搜索

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发明名称	A TAILORED BARRIER LAYER WHICH PROVIDES IMPROVED COPPER INTERCONNECT ELECTROMIGRATION RESISTANCE
摘要
申请公布号	KR20010033174(A)	申请公布日期	2001.04.25
申请号	KR1020007006556	申请日期	2000.06.15
申请人		发明人
分类号	H01L23/532	主分类号	H01L23/532
代理机构		代理人
主权项
地址

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