| 摘要 |
PURPOSE:To enhance the reliability of a resin-sealed semiconductor device. CONSTITUTION:At a resin-sealed semiconductor device, a bonding pad 3 at a semiconductor chip 1 is connected electrically to a lead frame via a metal wire 4. An aluminum oxide film 11 is formed, by an oxidation treatment, in parts where the metal wire 4 on the surface of said bonding pad 3 is not bonded. The aluminum oxide film 11 acts as a protective film, and the bonding pad 3 is hard to corrode. |
