| 摘要 |
PURPOSE:To prevent the generation of void in an IC and on the surface of the same and contrive the improvement of the reliability of the IC as well as the reduction of the faulty appearance of the same by a method wherein tablets are arranged in a vacuum vessel and air between the particles of the tablets is deaerated while the tablets are heated and compressed. CONSTITUTION:Tablets 1, solidified in a room temperature, are inserted into the cylinder 10 of a tablet molder 22 heated to the temperature of 50-60 deg.C by conducting a heater 21, thereafter, a cylinder 10 and an upper cover 11 are closed air-tightly. Subsequently, a cylinder chamber A and a vacuum introducing chamber B are evacuated, thereafter, the chamber B is sealed to hold the inside of the cylinder chamber A in vacuum. Then, a position 15 is moved upward to collapse the tablets 1 by compression under vacuum and powder them. In this case, air 2 between particles is diffused into the cylinder chamber A under vacuum condition and is deaerated immediately. When the powdered tablets 1 are compressed continuously, powders are welded by fusion sequentially from the outer peripheral part thereof by the heat of the tablet molder 22 and are integrated finally to the inside thereof whereby the tablet 1, provided with the diameter of 37mm which is the same as the inner diameter of the cylinder 10, may be completed. |
