| 摘要 |
PURPOSE:To provide a device which is small, cheap, and excellent in handling properties and bonds a coated wire composed of a core wire coated with a sublimating film to a joining part of a circuit board through a reflow bonding method. CONSTITUTION:A bonding head 20 which is vertically mounted on a vertically movable column 14 that can pivot in steps by 90 deg. and composed of a tool main body 21 mounted with a chip 25 at its tip, a wire guide 22 which feeds a coated wire 5 to the tip of the chip 25, and a cutter 23 which cuts the coated wire 5 after bonding and an X-Y table 12 which is mounted on a bed 10 confronting the bonding head 20 and where a circuit board is set horizontal are provided. |
