METHOD FOR DETECTING MOLDING AND CHIP ATTCHING STATE

摘要

A method for detecting a molding state and a chip attaching state of a semiconductor package is provided to determine automatically the molding state and the chip attaching state by using a vision system. A substrate is loaded on a table(20) after a chip attaching process or a molding process. A chip attaching state on the substrate is detected by shifting a vision camera(12) along X-Y coordinates. A molding state on the substrate is detected by shifting the vision camera along the X-Y coordinates. The data detected by the vision camera are compared with the predetermined reference data. The compared result is displayed by using a numeric expression method and a visual expression method.