| 摘要 |
The present invention has its object to provide a curable composition insuring a reduced stress without sacrificing restoring force and other physical properties and having a sufficient degree of adhesiveness.The present invention is related to a curable composition comprising comprising an oxyalkylene polymer having at least one reactive silicon group per molecule (A-1),an acid (B),an amine (C), anda tin-series curing catalyst (D).This composition optionally contains a vinyl polymer having at least one reactive silicon group.
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