Polishing method and polishing apparatus using the same

摘要

A polishing method is disclosed of polishing the surface of a layer provided on the surface of a substrate having the surface configuration measuring step of detecting the surface information of the layer at a plurality of locations and obtaining the surface configuration of the layer, the film thickness distribution measuring step of detecting the film thicknesses of the layer at a plurality of locations and obtaining the film thickness distribution of the layer, the determining step of determining whether the surface configuration and film thickness distribution of the layer are within a preset allowable range, and the polishing controlling step of continuing or stopping the polishing on the basis of the result of the determination at the determining step.