| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermally conductive silicone for heat radiation exhibiting good heat radiation properties, which does not droop down, does not come off from a radiating body even on displacement of a gap, and does not exert excessive stress on the radiating body, in case that the composition is filled in the displaceable gap between the radiating body and a heat-dissipation member and heated to effect surface curing. SOLUTION: This thermally conductive silicone composition for heat radiation comprises an organopolysiloxane (a) having an alkenyl group, a thermally conductive filler (b), an organohydrogenpolysiloxane (c) having two or more Si-H groups in average in a molecule, a platinum-family metal-based addition reaction catalyst (d) and a volatile reaction regulator (e) containing an aliphatic unsaturated group, where the group (e) volatilizes from the surface at the curing thereby causing curing of the surface part but the inner part remaining uncured. The quantity of the organohydrogenpolysiloxane (c) is one where the molar ratio of SiH group in (c)/alkenyl group in (a) is >0.6 and <10.0. The quantity of the regulator (e) is one where the molar ratio of SiH group in (c)/[alkenyl group in (a)+unsaturated group in (e)] is 0.05-0.5. COPYRIGHT: (C)2005,JPO&NCIPI
|
