Encapsulation method for electronic modules

摘要

An encapsulated electronic device includes a magnetically permeable core structure which is exposed within and coplanar with a flat top surface of the device. A bottom surface of the core may be exposed within the bottom surface of the device. The bottom core surface may be recessed beneath, coplanar with, or protruding from the bottom surface of the device. Alternatively the bottom surface may be encapsulated within the device. A method for manufacturing the exposed core package includes positioning a first component relative to a second component before encapsulating the device. An improved planar magnetic core structure includes internal bevels having a radius greater than or equal to 15% and preferably 25%, 35%, or as much as 50% of the core thickness to reduce concentration of the magnetic field around the internal corners.

主权项

1. A method of forming an encapsulated electronic device comprising:
providing an electronic assembly including one or more first components, each first component having a first structure and a second structure, the first structure moveable with respect to the second structure; providing a mold for encapsulating the electronic assembly including the one or more first components, and for forming at least a portion of an exterior shape of the encapsulated electronic device with cured encapsulant; closing the mold around at least a portion of the electronic assembly including the one or more first components; for at least one of the one or more first components, positioning the first structure of the first component relative to the second structure of the first component within a cavity of the mold; and filling the cavity of the mold with an encapsulating material to surround the portion of the electronic assembly including the one or more first components.