| 摘要 |
<p>1,233,083. Splitting. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. 5 July, 1969 [8 July, 1967], No. 32166/68. Heading B5E. [Also in Division H1] A semi-conductor wafer is secured to a foil 1 of synthetic resin by electrostatic attraction and is scribed and severed to form a number of segments. The foil 1 is then extended to space the segments apart so as to facilitate inspection and removal thereof, e.g. by a vacuum probe. In the apparatus shown the foil 1 is hermetically sealed to the edge 12 of a housing 15, and is drawn into a chamber 19 and over a plate 29 by vacuum, thereby extending the foil and separating the segments. A lamp arranged above the housing 15 provides the heat necessary to permit stretching. After extension the central part of the foil 1 carrying the spaced segments may be separated from the remainder of the foil. The plate 29 may carry a layer of glue to facilitate manipulation of the separated part of the foil. Initial severing of the scribed wafer is performed by means of a roller which presses the wafer into contact with a resilient pad mounted on a reciprocating support. The method is applicable to the manufacture of transistors or integrated circuits.</p> |
