发明名称 |
Method for making conductive circuits using powdered metals |
摘要 |
A method for making an electrically conductive pattern, including:(a) depositing on a substrate a metal powder composition consisting essentially of at least one metal powder, wherein the substrate is selected from the group consisting of paper and materials that are at least about 10% compressible; and(b) densifying the composition to form a conductive pattern on the substrate.
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申请公布号 |
US6805940(B2) |
申请公布日期 |
2004.10.19 |
申请号 |
US20010952239 |
申请日期 |
2001.09.10 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
KOSKENMAKI DAVID C.;KUHNS DAVID W. |
分类号 |
H05K3/40;H05K3/10;(IPC1-7):B32B3/10 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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