| 摘要 |
PURPOSE:To decrease the kinds of containers and to decrease the total stock even if the semiconductor elements is in variety of small amount by using a carrier, wherein electrodes electrically connected to the electrodes in the semiconductor element are provided on the surface for mounting the semiconductor element, and grid-shaped electrodes electrically connected to the inner electrodes are provided on the surface facing the semiconductor-element mounting surface. CONSTITUTION:A semiconductor element 11 is bonded to circuit board 12 with eutectic brazing filler metal, resin adhesive agent or the like. In the circuit board 12, electrodes, which are connected to the electrodes of the semiconductor elements, are provided, and external electrodes, which are arranged in the grid pattern on the rear surface facing the semiconductor-element mounting face, are provided. Thereafter, the inner electrodes of the elements and the carrier electrode are connected with thin metal wires. Then, the carrier 12, on which the element is mounted, is connected to the electrodes of the main body of a container, which are arranged in the grid pattern,with solder, conductive resin or the like electrically and mechanically. The carrier is covered with a cap 15, and sealing is performed by welding and the like. Therefore, the container 13 can be made the common container by sharing the arrangement of the grid- pattern electrodes at the outside of the carrier 12. |
