| 摘要 |
PROBLEM TO BE SOLVED: To provide a slide member capable of suppressing a deformation volume of a slide layer using a resin composition in the case of adding a load.SOLUTION: A porous sinter layer 4 comprises a plurality of metal particle phases 6 laminated on a surface of a rear metal layer 2 in a cross-sectional view, and a solder material phase 7 functioning as a binder of connecting the metal particle phases 6, and the metal particle phases 6 and the rear metal layer 2. A solder material constituting the solder material phase 7 has a Young's modulus of 120 GPa or more, and metal particles constituting the metal particle phases 6 have a Young's modulus higher than that of the solder material. Thus the Young's modulus of the solder material constituting the solder material phase 7 which connects the metal particle phases 6 is 120 GPa or more so as to make a junction between the metal particle phases 6 hard and hardly deformable, and in the case of adding a load to a slide member 1, the deformation of the porous sinter layer 4 is suppressed so as to reduce a deformation volume of a slide layer 3.SELECTED DRAWING: Figure 1 |
