| 摘要 |
PROBLEM TO BE SOLVED: To reduce the conduction failure of a wiring board or a semiconductor device, which has been integrated increasingly, and fabricate a highly reliable wiring board or semiconductor device with high yield.SOLUTION: A semiconductor device or a wiring board with a multilayer wiring structure includes wires that are connected through conductive layers with a curved surface. The end of the lower conductive layer, which is exposed by removing the peripheral insulating layer, has the curved surface, and this enables the excellent coverage of the upper conductive layer on the lower conductive layer. The conductive layers with the curved surface are formed by etching the conductive layers using a resist mask with a curved surface.SELECTED DRAWING: Figure 1 |
