| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bonding device which is capable of correcting a semiconductor chip both on wire bonding based on a bonding analysis and on deviation. SOLUTION: A horizontal tube 5 is provided below a bonding arm 3 in the transfer direction of semiconductor chips 1a and 1c and separate from the bonding arm 3 by a distance an integer times as long as a mutual distance between semiconductor chips 1a and 1c. The horizontal tube 5 is mounted on a bonding head main body 2 in such a manner that it is freely movable in the direction of X. The visual point of a camera 7 is set through the intermediary of the horizontal tube 5. By this setup, when the semiconductor chip 1c is transferred to a position A under a capillary 4, the visual point of the camera 7 through the intermediary of the horizontal tube 5 is located on the semiconductor chip 1a, so that the semiconductor chip 1a can be easily recognized after a bonding operation is carried out. |
