发明名称 CHIP ELECTRONIC COMPONENT
摘要 The present invention relates to a chip electronic component with an improved heat radiation function. The chip electronic component comprises: a main body of a magnetic material having an inner coil unit embedded therein; a core unit formed inside the inner coil unit; and a through-hole arranged in the core unit, and passing through the main body of the magnetic material.
申请公布号 KR20160069372(A) 申请公布日期 2016.06.16
申请号 KR20140175265 申请日期 2014.12.08
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 YOON, CHAN;LEE, DONG HWAN;AHN, YOUNG GHYU
分类号 H01F17/00;H01F27/28 主分类号 H01F17/00
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