LEAD FRAME, SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a technique which prevents short-circuit or wire deformation in a multi-lead semiconductor device and stabilizes bonding. SOLUTION: A support member 8 is fixed on inner leads 4 via an insulating member. A semiconductor-chip mounting region 2 is provided on the support member 8, and the tip parts of the inner leads 4 are arranged at equal intervals around the semiconductor-chip mounting region 2, so that the tip parts of the inner leads 4 are closer to the semiconductor-chip mounting region 2. Among the tip parts of the inner leads 4 arranged around the semiconductor-chip mounting region 2, the lead pitch between inner-lead tip parts corresponding to the corners of the semiconductor-chip mounting region 2 is wider than that between inner-lead tip parts corresponding to the other parts than the corners of the semiconductor-chip mounting region 2.