| 摘要 |
The present invention relates to a chip mounting method. The method includes: a step of providing a carrier substrate (1) which has a front surface (V) and a rear surface (R); a step of providing multiple first groups of first solder balls (L1,L2,L3,L4) on the front surface (V); a step of providing multiple second chips (C1,C2) on the front surface (V) according to a flip chip method, wherein each of the groups of the first solder balls (L1,L2,L3,L4) is placed around one corresponding chip; a step of providing a underfiller (UF) on the front surface (V) for at least filling the chip (C1,C2), wherein the UF sediments on the first solder ball (L1,L2,L3,L4) depending on regions; a step of performing a plasma cleansing step for removing at least partially the UF from the first solder ball (L1, L2,L3,L4), wherein the chip (C1,C2) is maintained to be at least partially filled; and a step of individualizing the chip (C1,C2) by combining the chip with each of the groups of the first solder balls (L1,L2,L3,L4) and a corresponding region (1a,1b) of the carrier substrate (1). |
