| 发明名称 | Connector | ||
| 摘要 | The instant disclosure relates to a connector including a wiring layer, a dielectric layer, a conductive structure, a first protective layer and at least one cantilever structure. The dielectric layer is disposed on the wiring layer, wherein the dielectric layer has at least one via hole to partially expose the wiring layer. The conductive structure is disposed on the inner wall of the at least one via hole of the dielectric layer and electrically connected to the wiring layer. The first protective layer is disposed on the dielectric layer. The cantilever structure is disposed between the first protective layer and the dielectric layer, wherein the at least one cantilever structure is electrically connected to the wiring layer via the conductive structure. | ||
| 申请公布号 | US9420690(B2) | 申请公布日期 | 2016.08.16 |
| 申请号 | US201514720979 | 申请日期 | 2015.05.26 |
| 申请人 | Unimicron Technology Corp. | 发明人 | Fan Chih-Peng;Hsieh Ching-Ho;Huang Chung-Chi |
| 分类号 | H05K1/11;H05K1/02;H05K3/00;H05K3/06;H05K3/28;H05K3/40 | 主分类号 | H05K1/11 |
| 代理机构 | Jianq Chyun IP Office | 代理人 | Jianq Chyun IP Office |
| 主权项 | 1. A connector comprising: a wiring layer; a dielectric layer disposed on the wiring layer, wherein the dielectric layer has at least one via hole to partially expose the wiring layer; a conductive structure disposed on the inner wall of the via hole of the dielectric layer and electrically connected to the wiring layer; a first protective layer disposed on the dielectric layer; and at least one cantilever structure disposed between the first protective layer and the dielectric layer, wherein the cantilever structure is electrically connected to the wiring layer through the conductive structure. | ||
| 地址 | Taoyuan TW | ||