| 摘要 |
PROBLEM TO BE SOLVED: To sufficiently secure the junction intensity of metallic thin wires by means of wire-bonding by jointing multiple terminals, arranged at prescribed pitches and the metallic thin wires through an anisotropic conductive film sheet containing multiple conductive particles in electric insulating binders. SOLUTION: A semiconductor element 13 is die-bonded on the mounting face 14a of a circuit board 14 through an adhesive 19. First pads 18 of the semiconductor element 13 and second pads 20 of the circuit board 14 are wire- bonded through the multiple metallic thin wires 22. First anisotropic conductive film sheets 23 are laid in the junction parts of the metallic thin wires 22 and the first pads 18. Second anisotropic conductive film sheets 24 are laid in the junction parts of the metallic thin wires 22 and the second pads 20. The first and second anisotropic conductive film sheets 23 and 24 have binders which have electric insulating property and adhesive property, and the multiple conductive particles which are dispersively arranged in the binders. |
