发明名称 PACKAGE STRUCTURE FOR HIGH-FREQUENCY DEVICE
摘要 PURPOSE:To sharply enhance the isolation characteristic between an input pin and an output pin by a method wherein the input pin and the output pin are equipped with a conductor or a dielectric which is installed on both sides along their extraction direction and a facing conductor which is installed face to face with a stem part is used. CONSTITUTION:An input pin 4 and an output pin 5 are bent to the direction which is opposite to each other near the extraction part; they are extracted to the outside of a can 7 along the plane of a printed-circuit board 14; a stem part 1 and the pins 4, 5 are kept in the non-contact state; a ring-shaped dielectric 21 is fixed to prevent short-circuiting. The input pin 4 and the output pin 5 along the plane of the printedcircuit board 14 function as internal conductors; the dielectric 21 installed along the same plane as this plane, a conductor 12 as a facing conductor and, furthermore, the stem part 1 function as external conductors; a coaxial path is formed at each pair of pins 4, 5; the extraction direction of these pins is opposite to each other; the coupling amount between the pins 4, 5 is reduced sharply. By this method, the isolation characteristic between the input pin and the output pin is enhanced.
申请公布号 JPS63170943(A) 申请公布日期 1988.07.14
申请号 JP19870001879 申请日期 1987.01.09
申请人 HITACHI DENSHI LTD;HITACHI LTD 发明人 SUMIOKA JUNJI;TABUCHI TOYOJI;HIKITA MITSUTAKA
分类号 H01L23/04;H01L23/02 主分类号 H01L23/04
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