| 摘要 |
The invention is characterised in, that in a first step a number of similar electronic devices (A-E) are placed on a wafer (1) in a manner such that the space occupied by one device (A-E) at least partly penetrates the area nominally reserved for an adjacent device (A-E), in that in second step all devices (A-E) are tested by an electrical and/ or optical test method, known per se, to determine the performance properties of each device and that in a third step devices (A-E) are separated from the wafer (1) in such a manner that devices that conform to performance specifications remain whole after separation, while devices that do not conform to performance specifications will no longer be intact. |
