发明名称 SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURE THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a package structure in which one end of a terminating resistor is joined to a conductor in a package and the wiring pattern of the package makes a microstrip line structure and to form the terminating resistor at an inexpensive price and with high accuracy. SOLUTION: In a metal board having four-layer structure comprising a metal plate, an insulating layer 5 formed on the metal plate, a resistor layer 3 of an adhesive layer formed on the insulating layer 5 and a metal foil formed on the resistor layer 3, the metal foil is formed in a wiring pattern 4 and an island 2 mounted with a semiconductor chip. A resistor made of the resistor layer 3 is formed between the island 2 and the wiring pattern 4 at predetermined positions. The metal plate is divided into a ground plane 6 and a part 7 joined to the outside terminal. The island 2 is joined to the ground plane 6 by a through hole 1 and becomes an earth potential and the wiring pattern 4 is joined to the part 7 joined to the outside terminal by the through hole 1.
申请公布号 JPH10308476(A) 申请公布日期 1998.11.17
申请号 JP19970130249 申请日期 1997.05.02
申请人 NEC CORP 发明人 SUZUKI KATSUNOBU
分类号 H01L23/12;H01L23/31;H01L23/498;H01L23/64 主分类号 H01L23/12
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