发明名称 MANUFACTURE OF COMPOUND BONDING WIRE
摘要 PURPOSE:To prevent eccentricity of ball for stabilizing contact bonding to a substrate by performing pressure welding of a core material consisting of Ag or Ag alloy and a coated material consisting of Au or Au alloy, performing thermal diffusion treatments once or two times, or more, and then performing wire drawing to a particular diameter by cold working. CONSTITUTION:An Ag cylindrical bar 1 which is a core material is engaged to an Au pipe 2 which becomes a coated material to form a two-layer cylinder 3 and metals (dummy blocks) 7 and 8 for protection are coated around this periphery to form a compound coated material 10 (billet). After performing wire drawing of this into a compound coated wire using the hot static water pressure extrusion or hot lubrication extrusion, a coated wire is formed by removing a metal for protection and thermal diffusion treatment is performed for two times or more at a diameter which is two times or more of the target wire diameter during wire drawing machining. Furthermore, wire drawing is performed for a compound bonding wire with a wire diameter of 25-30mum. It allows eccentricity of ball to be restricted on bonding and the thickness of coated materials to be constant.
申请公布号 JPH01259541(A) 申请公布日期 1989.10.17
申请号 JP19880088426 申请日期 1988.04.11
申请人 KOBE STEEL LTD 发明人 MORITA AKIYASU
分类号 H01L21/60 主分类号 H01L21/60
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