| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for connecting an electronic component having sufficient conductivity and thermal conductivity and capable of forming a junction having a sufficient thickness, a method for manufacturing an electronic device and the electronic device. SOLUTION: The method for connecting the electronic component comprises a metallic member forming step of forming a metallic member 3 on at least one connecting surface of a first electronic component 1 or a second electronic component 7, a conductive resin forming step of forming a conductive region 5 on the other connecting surface or the member 3, and a step of connecting the component 1 to the component 7 via the member 3 and the resin 5.</p> |
