Interconnect making involves patterning protective layer to form openings to conductive layer, depositing contact pads comprising conductive material on the conductive layer, and patterning the conductive and protective layers

摘要

An interconnect is made by depositing a conductive layer (12) on a substrate (10), depositing a protective layer (16) on the conductive layer, patterning the protective layer to form openings (20, 22) to the conductive layer, depositing contact pads comprising a conductive material on the conductive layer through the openings layer, and patterning the conductive layer and protective layer to form electrical traces on the substrate. Independent claims are included for: (1) an interconnect; (2) a structure comprising a substrate that substrate does not include bus lines routing to a common bus, a conductive layer patterned to form electrical traces on the substrate, contact pads disposed on the conductive layer, and a protective layer disposed on the conductive layer and patterned to only cover the electrical traces; and (3) an electronic package. The protective layer comprises titanium, tungsten, nickel, molybdenum, chromium, and/or monel. An adhesion promoting coating is deposited on the substrate prior to the conductive layer deposition. It comprises titanium, nickel, molybdenum, chromium, tungsten, and/or monel. A first nickel layer is deposited on the conductive layer. A second layer comprising gold and/or palladium is deposited on the first layer.