发明名称 Plasma generating device
摘要 A plasma generating device and a method for etching a minute region of a substrate under atmospheric pressure are disclosed. A gas containing helium as the main ingredient is glow discharged under atmospheric pressure, a halide is added to the discharge so as to activate the halogen element, and a solid material (substrate) such as silicon is chemically etched by using the radioals. At that time, a magnetic field acts on the discharge so as to draw out electrons and ions to the surface of the substrate, thereby increasing the radical density in the vicinity of the surface of the substrate and the etching rate.
申请公布号 US5369336(A) 申请公布日期 1994.11.29
申请号 US19930009992 申请日期 1993.01.27
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 KOINUMA, HIDEOMI;YAMAZAKI, SHUNPEI;HAYASHI, SHIGENORI
分类号 C23F4/00;B29C59/14;H01J37/32;H01L21/302;H01L21/3065;H05H1/46;(IPC1-7):H01J7/24 主分类号 C23F4/00
代理机构 代理人
主权项
地址