| 摘要 |
PROBLEM TO BE SOLVED: To raise the degree of integration of MCM(multichip module). SOLUTION: For a hybrid integrated circuit, the connection of fixed potential of the earth or the like of each integrated circuit chip 106 is performed through a through connection 110 made in a through hole piercing a lower insulating layer 102, an interlayer insulating layer 104, and a through hole 110. That is, the hybrid integrated circuit is connected to the fixed potential terminal of the earth or the like of the integrated circuit chip 106, the specified electrode of the second wiring layer 10, the through hole connection 110, and an island 101a. |
