发明名称 EXPOSURE METHOD AND EXPOSURE DEVICE, EXPOSURE UNIT, AND DEVICE MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To efficiently expose a plurality of regions on a substrate with corresponding patterns. <P>SOLUTION: An exposure method of exposing a plurality of different regions on a wafer W2 includes a process of holding the wafer W2 on a simple stage 13 and measuring first measurement information including position information of at least one of a direction along a surface of the wafer W2 and a normal direction on the surface, a process of exposing a non-device region on the wafer W2 based upon the first measurement information, a process of mounting the wafer 2 on a wafer stage WST, and a process of driving the wafer stage WST using the first measurement information to expose device regions on the wafer W2. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009135166(A) 申请公布日期 2009.06.18
申请号 JP20070308308 申请日期 2007.11.29
申请人 NIKON CORP 发明人 NAGAYAMA TADASHI
分类号 H01L21/027;G03F7/20 主分类号 H01L21/027
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