发明名称 |
NANO-GRAINED MULTILAYER COPPER ALLOY SHEET HAVING HIGH STRENGTH AND HIGH ELECTRICAL CONDUCTIVITY, AND METHOD FOR MANUFACTURING SAME |
摘要 |
A nano-grained multilayer copper alloy sheet having high strength and high electrical conductivity according to the present invention is characterized in that the sheet is prepared by repetitively roll-bonding an oxygen-free copper (OFC) alloy and deoxidized low-phosphorous copper (DLP) alloy thus having an electrical conductivity of 85 IACS (%) or more and a tensile strength of 400 MPa or more. A method for manufacturing a nano-grained multilayer copper alloy sheet having high strength and high electrical conductivity, according to the present invention, is characterized in that it comprises: a raw material preparation step of preparing a sheet comprised of an oxygen-free copper (OFC) alloy and deoxidized low-phosphorous copper (DLP) alloy; a surface treatment step of performing surface treatment on the sheet; and a sheet forming step of repetitively roll-bonding the sheet to form a nano-grained multilayer copper alloy sheet having high strength and high electrical conductivity which has an electrical conductivity of 85 IACS (%) or more and a tensile strength of 400 MPa or more. |
申请公布号 |
WO2012096456(A3) |
申请公布日期 |
2012.09.07 |
申请号 |
WO2011KR10073 |
申请日期 |
2011.12.26 |
申请人 |
KOREA INSTITUTE OF MACHINERY & MATERIALS;KIM, HYOUNG WOOK;LIM, CHA YONG |
发明人 |
KIM, HYOUNG WOOK;LIM, CHA YONG |
分类号 |
B23K20/04 |
主分类号 |
B23K20/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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