| 摘要 |
A method and device for interconnecting stacked semiconducting plates, in which each of the plates has an integrated circuit. The semiconducting plates (P) are stacked and made solid with each other. In one embodiment, their connecting contacts are connected by a wire (F) to any one of the faces of the stack except one (B), which is to be in contact with a printed circuit. Connections of the plates together and with the printed circuit is made on the faces (FV, FS, FL) of the stack. |
