| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition containing a polyimide precursor, developable with an aqueous alkali solution and having positive pattern forming ability and to provide a new positive pattern forming method. SOLUTION: The positive photosensitive resin composition contains (A) a polyimide precursor, (B) a vinyloxy-containing compound such as triethylene glycol divinyl ether, (C) a photosensitive agent which is degraded under active light such as UV to generate an acid, (D) a compound which accelerates the degradation of the photo-acid generating agent and (E) a solvent. In the positive pattern forming method, a coating insoluble in an aqueous alkali solution is formed by the components A and B, exposed with active UV and heated, only a part exposed and decomposed by the acid generated from the component C is dissolved in the aqueous alkali solution to develop a positive pattern and then imidation and heat treatment are carried out. |
