INTEGRATED CIRCUIT DEVICE AND INTEGRATED CIRCUIT MULTI-CHIP PACKAGE FOR TRANSMITTING INPUT SIGNALS VIA ANOTHER CHIP

摘要

PROBLEM TO BE SOLVED: To provide an integrated circuit device and an integrated circuit multi-chip package for transmitting input signals via another chip. SOLUTION: When an input signal that a logic circuit in a first chip requires is a signal necessary for a logic circuit in a second chip also in the integrated circuit multi-chip package/integrated circuit device, the input signal is transmitted to each of logic circuits in the first and second chips through a synchronization device at the same time. In the case where further more, three or more chips are packaged in a package, it is also possible to transmit the relevant input signal supplied through the synchronization device selectively to other chips also. COPYRIGHT: (C)2006,JPO&NCIPI