| 发明名称 |
WAFER HEATER |
| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a wafer heater comprising a ceramic soaking plate having one major surface serving as a wafer mounting surface and the other major surface embedded with a heater and mounting a power supply section connected electrically with the heater wherein temperature distribution on the wafer surface is made uniform at the time of remounting the wafer. SOLUTION: A plurality of pins for supporting a wafer are provided on the mounting surface wherein the projecting height of the supporting pins from the mounting surface is set in the range of 0.05-0.5 mm and variation thereof is set within 15μm.</p> |
| 申请公布号 |
JP2001313243(A) |
申请公布日期 |
2001.11.09 |
| 申请号 |
JP20000130854 |
申请日期 |
2000.04.28 |
| 申请人 |
KYOCERA CORP |
发明人 |
UCHIYAMA KYOJI;TANAKA SATOSHI;TAKENOUCHI HIROSHI;NAGASAKI KOICHI |
| 分类号 |
H01L21/683;H01L21/027;H01L21/205;H01L21/68;(IPC1-7):H01L21/027 |
主分类号 |
H01L21/683 |
| 代理机构 |
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代理人 |
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| 地址 |
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