发明名称 MOUNTING SUBSTRATE AND ELECTRONIC DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a mounting substrate which enables an electronic component to be stably mounted without causing cracks or peeling etc. of a joint member etc. and achieves good heat radiation performance, and to provide an electronic device which uses the mounting substrate.SOLUTION: A mounting substrate includes a base material 11 and a pair of wiring patterns 12 which are disposed on the base material 11 separated from each other. Each wiring pattern 12 includes: a placement part 12a on which an electronic component is mounted; and a hole 12b exposing a part of the base material 11. The hole 12b is placed on an outer edge of the placement part 12a.SELECTED DRAWING: Figure 1
申请公布号 JP2016157918(A) 申请公布日期 2016.09.01
申请号 JP20150241247 申请日期 2015.12.10
申请人 NICHIA CHEM IND LTD 发明人 ISHIDA MASASHI;IDE YOSHIYUKI;AKI TAKESHI;HAYASHI TATSUYA;KITAJIMA TADAYUKI
分类号 H01L23/12;H01L33/62;H05K3/34 主分类号 H01L23/12
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