发明名称 |
MOUNTING SUBSTRATE AND ELECTRONIC DEVICE USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a mounting substrate which enables an electronic component to be stably mounted without causing cracks or peeling etc. of a joint member etc. and achieves good heat radiation performance, and to provide an electronic device which uses the mounting substrate.SOLUTION: A mounting substrate includes a base material 11 and a pair of wiring patterns 12 which are disposed on the base material 11 separated from each other. Each wiring pattern 12 includes: a placement part 12a on which an electronic component is mounted; and a hole 12b exposing a part of the base material 11. The hole 12b is placed on an outer edge of the placement part 12a.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016157918(A) |
申请公布日期 |
2016.09.01 |
申请号 |
JP20150241247 |
申请日期 |
2015.12.10 |
申请人 |
NICHIA CHEM IND LTD |
发明人 |
ISHIDA MASASHI;IDE YOSHIYUKI;AKI TAKESHI;HAYASHI TATSUYA;KITAJIMA TADAYUKI |
分类号 |
H01L23/12;H01L33/62;H05K3/34 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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