Assemblies of substrates and electronic components

摘要

An assembly of a substrate (10) and an electrical or electronic component (12), the component having electrically conductive leads (14) with surfaces of an alloy of tin and copper and the leads (14) being soldered to copper based terminals (16) of the substrate (10) by a solder alloy (18) of tin and copper. Lead solder is thus avoided. Preferably each conductive lead (14) has a surface layer (22) of the alloy of tin and copper and core (20) within the surface layer of another material which remains solid at the soldering temperature of the surface layer (22). Also included is a method of soldering a component (12) with electrically conductive leads (14) having surfaces of tin and copper alloy to copper based terminals (16) by a solder alloy (18) of tin and copper.