发明名称 HOLDING DEVICE FOR DIE
摘要 PROBLEM TO BE SOLVED: To applying masking in such a manner that a conducted part between a die base material and a holder is not plated. SOLUTION: The tip of a holder 11 is fitted with a die base material 10 by a screw structure, and the edge face 40 of the die base material 10 and the bottom face 41 of a male screw 18 are partially conducted. Thereafter, the holder 11 is fitted with a masking member 12. In this way, the range requiring plating including a forming face 13 in the die base material 10 is exposed from the opening part 31 provided at the masking member 12 to the outside. Then, the conducted part between the bottom face 41 and the edge face 40 is securely waterproofed with packing 22 provided at the holder 11 and packing 32 provided at the masking member 12. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007239010(A) 申请公布日期 2007.09.20
申请号 JP20060062040 申请日期 2006.03.08
申请人 FUJINON CORP 发明人 TAKAGI EIJI
分类号 C23C18/31 主分类号 C23C18/31
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