| 摘要 |
PROBLEM TO BE SOLVED: To reduce the process cost by substituting a circuit method for a corresponding region, when forming a trench for mounting an electronic element.SOLUTION: An electronic element built-in printed circuit board includes a first insulation layer 110 in which a trench is formed, an electronic element 120 mounted on the trench bottom of the first insulation layer 110, a second insulation layer 115 formed above the first insulation layer 110 where the electronic element 120 is mounted, and a circuit layer 130 formed on the outer surface of the first insulation layer 110 and the second insulation layer 115.SELECTED DRAWING: Figure 1 |
