发明名称 POLISHING PAD AND POLISHING DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To restrain clogging and accomplish uniform polishing regardless of conditioning by forming plural through holes piercing along the direction of thickness on the whole surface. SOLUTION: A polishing pad 10 has a circular outline about 1 mm-2 mm thick, and includes plural small tubes 11 having an inside diameter corresponding to the diameter of each through hole 11a, plural large tubes 12 for binding the small tubes 11, having an inside diameter larger than the outside diameter of each small tube 11, and adhesive layers for making the sides of the large tubes 12 adhere to each other. Thus, each through hole 11a of the polishing pad 10 is formed deep, so that the frequency of clogging caused by polishing scraps can be reduced to as to improve uniformity of polishing, and the number of times of conditioning is decreased to lengthen the life of the polishing pad. Furthermore, the condition of the polishing pad 10 can be stabilized so as to improve uniformity of polishing.
申请公布号 JPH1199468(A) 申请公布日期 1999.04.13
申请号 JP19970263665 申请日期 1997.09.29
申请人 TOSHIBA CORP 发明人 EGASHIRA KATSU;KATAKABE ICHIRO;MIYASHITA NAOTO;MASE KOICHI;ABE MASAYASU;KITAMURA TOSHIHIKO
分类号 B24B37/20;B24B37/22;B24B37/26;H01L21/304 主分类号 B24B37/20
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