Lead frame adapted for variable sized devices, semiconductor package with such lead frame and method for using same

摘要

A lead frame and a semiconductor package using the lead frame are disclosed in which one lead frame can be used to perform the package process regardless of the size of a chip. The size of the chip can be varied within the limit that the number of bonding pads of the chip does not exceed the number of corresponding inner leads. The lead frame includes a plurality of tie bars extended toward the center from edges of a lead frame body, a die pad supported by the tie bars on which a semiconductor chip can be bonded and a plurality of inner leads disposed around the die pad. The tie bars, the die pad and the inner leads are preferably in the same plane. The inner leads are electrically coupled with bonding pads of the chip. A plurality of outer leads respectively coupled with the inner leads and exposed outside a molded package.