Refurbishing copper and indium containing alloy sputter targets and use of such targets in making copper and indium-based films

摘要

This invention relates to a method of refurbishing sputter targets comprising: providing a sputter target comprising a temperature sensitive alloy, having regions depleted of material; providing a powder having a first phase comprising the desired temperature sensitive alloy onto the surface; and pressing the powder onto the surface to form a refurbished target, at temperatures lower than that which would damage the temperature sensitive alloy.

主权项

1. A method comprising:
providing a sputter target comprising copper and indium having a surface with at least one region depleted of material; providing a powder having a first phase comprising copper and indium onto the surface on at least the at least one region depleted of material; and cold isostatic pressing the powder onto the surface to form a refurbished target.