发明名称 COATING TYPE ETCHING METHOD AND APPARATUS THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a coating type etching method and apparatus therefor which can make the manufacturing time shorter, the manufacturing cost lower and the yield higher by eliminating the need for forming a mask on the surface of a work for protecting the segments unnecessary for etching treatment in case partially etching the surface of the work is carried out and can effectively use a liquid chemical by realizing the etching treatment with the minimum consumption of the liquid chemical. SOLUTION: A coating means impregnated with the liquid chemical is slid on the surface of the work in the state of bringing the coating means into contact with the surface of the work, thereby, the liquid chemical is applied to the surface of the work and the surface of the work is etched.
申请公布号 JP2002155381(A) 申请公布日期 2002.05.31
申请号 JP20000348607 申请日期 2000.11.15
申请人 MIMASU SEMICONDUCTOR INDUSTRY CO LTD 发明人 TSUCHIYA MASATO;OGASAWARA SHUNICHI
分类号 B05D1/28;B05C1/02;B05C11/08;B05D1/40;B05D3/00;B05D3/10;C23F1/08;H01L21/306;(IPC1-7):C23F1/08 主分类号 B05D1/28
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